Die Bonding Movie Review 1984

This program explains the common methods of bonding chips and dies to substrate electronic components.

Distribution

RMI Media, 1365 N. Winchester, Olathe, KS 66061, Phone: (913)768-1696, Fax: (913)768-0184, Email: actmedia@act.org, URL: http://www.rmimedia.com, Remarks: A division of Act, Inc.

Available on VHS
Running time 6 minutes.

Cast and Crew

Genres

Electricity, Electronics

Producer

RMI Media Productions