Future Trends in Chip and Board-Level Integrated Circuit Packaging Movie Review 1989

Information and Film Reviews for Future Trends in Chip and Board-Level Integrated Circuit Packaging the Movie

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The primary functions of integrated circuit packaging are explained.

Distribution

University of Arizona, University Teaching Center, 1017 N. Mountain Ave., PO Box 210102, Tucson, AZ 85721-0102, Phone: (520)621-7788, Fax: (520)626-7314, URL: http://www.utc.arizona.edu

Available on VHS
Running time 60 minutes.

Cast and Crew

Genres
Electronics, Technology
Producer
University of Arizona

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